Form：Hua Hong Semiconductor 2017/12/27Browse：4486
Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.
Form：NXP Semiconductors 2017/9/19Browse：5732
NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.
Form：Semtech 2017/9/8Browse：4885
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance analog and mixed-signal semiconductors products and advanced algorithms, today announced that Chipsafer, a startup that specializes in providing Internet of Things (IoT) services for livestock management, uses Semtech's LoRa® devices and wireless RF technology (LoRa technology) to develop its ranch solution platform. Chipsafer's sensors forward sensor data from livestock, including body movements, local humidity, temperature and location, using LoRaWAN-based gateways and LoRaWANTM protocols.
Form：Semtech Corporation 2017/8/29Browse：3915
Semtech Corporation, a leading provider of high-performance analog and mixed-signal semiconductors products and advanced algorithms, today announced that the high-tech enterprise, which specializes in smart home and lifestyle products, is dedicated to integrating Semtech's LoRa devices with radio frequency Technology (LoRa technology) as its preferred platform for its Internet of Things (IoT) equipment.
Form：Chinatimes 2017/8/17Browse：3672
Memory plant Winbond successfully into the Apple iPhone 8 supply chain. According to Apple supply chain industry, said Winbond exclusive supply of NOR Flash products, and Samsung AMOLED panel together into a mobile phone panel module, in August began heavy volume shipments, and applied in the Apple iPhone 8 products, on behalf of China Bang electric operation will be expected to flourish to the first half of next year.
Form：HuaWei 2017/8/17Browse：3790
With Huawei Mate 10 will be released in mid-October news, this new machine equipped with the Kirin 970 processor, naturally became a lot of people concerned about the topic.
Form：Microchip 2017/8/16Browse：3987
Microchip Technology Inc. today announced MPLAB ICD 4 - Microchip's online programming and debugging development tools for the PIC microcontroller and dsPIC digital signal controller family.
Form：Synopsys 2017/8/9Browse：3698
Synopsys today introduced the complete DesignWare High-Bandwidth Memory 2 (HBM2) IP solution, which includes controllers, PHYs and authentication IPs, enabling an aggregate bandwidth of 307 GB / s and a DDR4 interface at 3200 Mb / s data transfer rate operation under 12 times.
Form：Microsemi Corporation 2017/8/9Browse：3780
Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions for power, security, reliability and performance, today announced that its Switchtec PAX network interconnects Gen3 PCIe switching chips to provide high-performance network connectivity , For scalable multi-host systems and Just a bunch of flash (JBOF), and supports single input / output (I / O) virtualization (SR-IOV), NVMe, and multifunction endpoints.
